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Agensi Pekerjaan Synergy Staffing

TECHNICIAN

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  • a month ago
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Job Description

JOB VACANCY Contract Technician / 12month wth renewal
  • COMPANY NAME : NXP Malaysia Sdn Bhd
  • LOCATION : 2, Jalan SS 8/2, Sungai Way Free Trade Industrial Zone, 47300 Petaling Jaya, Selangor
  • POSITION : Contract Technician / 12month wth renewal
  • WORKING HOUR : 9 hours / 5 days a week
  • SALARY : Depending on candidate work experience and prior salary
  • REQUIREMENT:
Minimum Diploma
  • Minimum 1year working experience, preferably related to either frontend assembly, wire bond process or backend assembly process development.
Candidate with work experience but not related to semiconductor industry or fresh graduates with a diploma are also welcome to apply for this position.
  • Have some basic knowledge in direct and indirect materials related to assemble process and packaging development work.
Basic materials science as well as basic FA related tools knowledge will be an added advantage
  • Ability to work independently with minimum supervision
Team player and ready to work with other groups, such as assembly process engineering, equipment engineering, quality, product group and others
  • Self-motivated and eager to experience new challenges
Able to work under pressure to meet quality and timely delivery metrics
  • English, Malay, Mandarin (if applicable)
  • Job description:

The Package Innovation technician is responsible for the development, execution, and qualification of semiconductor assembly processes to meet product requirements and to enable timely new product introduction. In your role, you will work as a member of Assembly Process Innovation to support engineers in assembly processes and new packaging development. You will work together with process engineering, equipment, and production teams to ensure that the newly introduced product is meeting all requirements for quality and manufacturability.

  • Responsibilities:
Capable to support engineers in setting up and trouble shoot assembly machines such as wafer grooving, stealth dicing, wafer saw, die bond, wire bond, mold, solder ball attach and trim form.
  • Ability to learn and be trained hands-on on the assembly machines (as above) to allow recipe creation and process related trouble shoot work.
Hands-on experience in handling wire bonder with experience in K&S platform for Maxum series and above are of added advantage.
  • Willing to learn and continue to upgrade skill set with new assembly processes or machines.

Job Type: Contract
Contract length: 12 months

Schedule:



Day shift

More Info

Industry:Other

Function:semiconductor industry

Job Type:Permanent Job

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Date Posted: 26/10/2024

Job ID: 98127743

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