Quality improvement activities on DDM investigation, disposition and improvement
In your new role you will:
- Yield improvement activities for Die Attach process
- Sustain and achieve stability index for package under responsibility
- Support production on daily issues investigation and improvement in order to achieve Operation performance
- Sustain and achieve quality stability for DPAK module DA process to achieve zero spill, FAR
- Documents update and refine to ensure no expired documents.
You are best equipped for this task if you have:
- Bachelor degree in engineering
- Knowledge in die attach process and skill
- ESEC 2007/2009 Soft Solder and Diffusion Soldering
- Knowledge in process engineering
- Basic statistical and SPC knowledge
- Basic problem solving skill 8D, MRB, DMAIC
Driving decarbonization and digitalization. Together.
Infineon designs, develops, manufactures, and markets a broad range of semiconductors and semiconductor-based solutions, focusing on key markets in the automotive, industrial, and consumer sectors. Its products range from standard components to special components for digital, analog, and mixed-signal applications to customer-specific solutions together with the appropriate software.
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicants experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
