Drive Back End Package Assembly and Test Projects under OSAT (Outsourcing Assembly & Test) function to enable turnkey/full turnkey of high volume manufacturing for Infineon's Connected and Secure Systems (CSS) business division products in our subcontractors manufacturing sites present globally.
In your new role you will:
- Undertake low to medium-complexity projects per Infineon's project classification and category guidelines.
- Identify package-level cost-down opportunities and drive cost-down projects.
- Initiation, planning, execution, control and closure of package assembly and test development as well as change management projects within the committed scope, budget and timeline.
- Drive package definition, technology integration and requirements engineering as part of the project initiation process Apply Infineon's Assembly/Global Change Management (GCM)business process, systematics and project management tools and methods to structure the projects, control, manage risks and changes throughout the project lifecycle.
- Responsible for operational decisions in the project and for driving the major milestone release decisions in the project review and approval platform.
- Collaboration with cross-functional project teams from various locations, to solve complex problems and identify innovative solutions.
- Facilitate/support the alignment of Subcon Technology roadmaps with segments and representatives of the Package Technology and Innovation (PTI) function.
- Actively manage the project and proactively manage potential deviations to avert delays and additional costs. Escalation management.
- Drive package platform assessment between subcons and provide mapping to in-house capability supported by the segments and package platform managers.
- Collaborate with internal partners across various functions and regions, such as from business division, package concept engineering, procurement, IT systems enabling, engineering, planning, quality, procurement, product program management and package platform management.
You are best equipped for this task if you have:
- Minimum Bachelor's Degree in Mechanical/Electrical/Electronics/Manufacturing/Material Science/Mechatronics Engineering.
- Project management or related training with certification will be an advantage.
- Minimum 5 years experience as a project manager driving Semiconductors Back-End Assembly & test high volume manufacturing capability development projects. Technical knowledge of Semiconductor back-end assembly/Test processes will be an advantage.
- Strong interpersonal, communication, presentation, analytical and reasoning skills for leading and working in a global outreach project-based matrix organization; ability to build long-lasting relationships and trusted partnerships with internal and external stakeholders.
- Willing to travel to subcon manufacturing sites based on project/business needs.
Driving decarbonization and digitalization. Together.
Infineon designs, develops, manufactures, and markets a broad range of semiconductors and semiconductor-based solutions, focusing on key markets in the automotive, industrial, and consumer sectors. Its products range from standard components to special components for digital, analog, and mixed-signal applications to customer-specific solutions together with the appropriate software.
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This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicants experience and skills.
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