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Agensi Pekerjaan Synergy Staffing

Package Innovation Technician

Early Applicant
  • 29 days ago
  • Be among the first 50 applicants

Job Description

Job description:
  • The Package Innovation technician is responsible for the development, execution, and
qualification of semiconductor assembly processes to meet product requirements and to enable timely new product introduction. In your role, you will work as a member of Assembly Process
  • Innovation to support engineers in assembly processes and new packaging development.
Work together with process engineering, equipment, and production teams to ensure that the newly introduced product is meeting all requirements for quality and manufacturability.

  • Responsibilities:
Capable to support engineers in setting up and trouble shoot assembly machines such as wafer grooving, stealth dicing, wafer saw, die bond, wire bond, mold, solder ball attach and trim form.
  • Ability to learn and be trained hands-on on the assembly machines (as above) to allow
recipe creation and process related trouble shoot work.
  • Hands-on experience in handling wire bonder with experience in K&S platform for
Maxum series and above are of added advantage.
  • Willing to learn and continue to upgrade skill set with new assembly processes or
machines.
  • Requirements:

Minimum 1year working experience, preferably related to either frontend assembly, wire bond process or backend assembly process development.
  • Candidate with work experience but not related to semiconductor industry or fresh
graduates with a diploma are also welcome to apply for this position.
  • Have some basic knowledge in direct and indirect materials related to assemble process and packaging development work.
Basic materials science as well as basic FA related tools knowledge will be an added
advantage
  • Ability to work independently with minimum supervision
Team player and ready to work with other groups, such as assembly process
engineering, equipment engineering, quality, product group and others
  • Self-motivated and eager to experience new challenges
Able to work under pressure to meet quality and timely delivery metrics

Job Type: Contract
Contract length: 12 months

Pay: RM2,
  • 00 - RM3,000.00 per month

    Benefits:
  • Health insurance
Opportunities for promotion
  • Professional development
Schedule:
  • Monday to Friday
Supplemental pay types:
Overtime pay

More Info

Industry:Other

Function:semiconductor industry

Job Type:Permanent Job

Skills Required

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Date Posted: 26/10/2024

Job ID: 98127765

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