Die Attach (DA) Process Engineering Manager

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

In this position, the individual will be responsible for fully supporting the Department Manager on the development of the company goals, strategy and tactics. The most important expectation is being able to work with the other team to assure the good execution of daily activities and special assignments assigned by department managers or higher management. The individual will be responsible to lead the process engineering functions for DA process. He/she is required to work closely with the teams within Assembly Process Engineering department as well as other functional teams manufacturing, EE, IPPC, QA ,NPI and other supporting teams to fully support the company and department goals on yield, quality, and cost, utilization, productivity and cycle time. Good knowledge Die Attach process with hands on experience.

To be qualified for this position, the individual shall come with the following skills

• Able to lead a group of process engineers and technician. Be a mentor and coach for the engineers and technicians, provide the technical supports whenever necessary
• Good in problem solving skills by applying the standard solving methodology, DMAIC, 8D, etc
• Good working knowledge in MSA & SPC and DOE
• Document of SOP, WI, FMEA, FMEA+, OCAP and Control Plan for related process.
• Ensure effective hand shaking process of new device/product introduction to the line and new process technology capabilities developments.
• Responsible for new material/component first articles inspection and final buyoff.
• Continuous improvement on direct/indirect material cost down & yield enhancement program.
• Ensure robustness of process control to meet yield & through-put expectation.
• Report any non-conformance/customer complains issue and develop/follow up the improvement actions.
• Lead or work together with other sites of WD for project transfer or sharing of improvement projects.
• Fully participate to resolve the issue thru teamwork, and be the main coordinator for any internal/ external audit programs.

Qualifications

REQUIRED:

• Master or Bachelor degree in Mechanical/Material/Electrical/Electronic Engineering or Physics
• 5+ years of process engineering experience in semiconductor assembly on engineering for equipment maintenance/repair/improve in DA.
• Accept flexible working time if needed.

SKILLS:

• Knowledge on DA and Die Sort process, familiar with RENESAS DIE BONDER machine and C-SUN/UTIC/APT.
• Experience in handling the high die stack DA, 1D until 16D with very thin die capability.
• Involved in yield improvement activities using statistic tools and drive yield meeting with internal and external team.
• Lean Six Sigma Knowledge is preferable.
• Basic understanding of package level testing & reliability.
• Proficient in standard business application software, Tools & standard engineering method (Word, Excel, PowerPoint, AutoCAD, JMP, SPC, DOE, DMAIC, 8D, 5-why etc.).
• A proven desire to work as a team member, both on the same team and outside of the team.
• Ability to troubleshoot and analyze complex problems.
• Ability to multi-task and meet deadlines.
• Excellent English communication (written and verbal) and interpersonal skills.

Additional Information

Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

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